The technology of the plating through hole of the printed circuit board was briefly introduced The plating through hole technology of the microwave printed circuit board were also illuminated. 本文在简单介绍印制板孔金属化加工技术的基础上,对微波印制板孔金属化加工技术进行了较为详细的论述。
Universal first built electronic circuit assembly equipment for through hole components in the1960s. 公司先是在60年代建立了通孔零部件的电子线路组装设备。
The right selection of independent cycle circuit in the calculation of Kirchhoff law is studied. Two methods, namely, the method of single chain cycle circuit and the method of plane net hole are given. 分析了两种选择独立回路的错误作法,给出了两种正确选择独立回路的方法,即单链回路法和平面网孔法。
Machining of PCB ( printed circuit board) is a typical process of two dimensional multi hole. 印刷电路板PCB的加工是二维多孔数控钻的典型。
Along with rapid progress of manufacturing technology on PCB, it is getting more and more precise and miniature for the circuit layout density and hole-diameter on HDI board so that it can conform a new hole formation technology by laser shooting to meet machining requirement of HDI; 随着PCB制作技术的高速发展,HDI基板布线密度与孔径分布日趋精密化、微型化,顺应HDI成孔加工技术需要,激光成孔技术在国内得到广泛应用。
Spindles of the multiple spindles heads are located evenly in the circuit and can be adjusted synchronism on the diameter's direction to meet the small scale production needs of the screw hole manufacture for flange plate parts. 该多轴头各轴在圆周方向均布且可方便地沿直径方向同步调整,以适应多种小批量生产条件下法兰盘类零件的螺孔加工。
When circuit weld hole is welded on center sills, CIR command adopted traditionally to weld circle arc is changed due to narrow welding space. ARC command has substituted for CIR command, resolving undercut welding defects existing on circuit weld seam. 在焊接中梁环行塞焊孔时,由于焊接空间的狭小,突破了传统的直接采用CIR命令焊接圆弧的方法,以ARC的命令代替CIR命令,解决了环行焊缝焊接咬肉的焊接缺陷问题。
The colloidal Pd is mainly used in metallization of printed circuit board ( PCB) hole for electronic component assembling Pd in waste colloidal Pd needs to recover. 胶体钯用于印刷电路中电子元件连接用电路板(PCB)孔的金属化,对废胶体钯中的Pd需加以回收。
With taking the DISPEN, KONI dampers as the examples, the effects of circulating oil circuit, valve structure selection and air hole, oil vapor separation on the performance of the dampers are analyzed. 以DISPEN、KONI减振器为例,分析了减振器的循环油路、阀结构选取及气穴现象、油汽分离对减振器性能的影响。
Rigid-flex PCB is derived by bonding two rigid outer on flexible PCB. The circuit of the rigid layer and flexible layer are connected by metalized hole. 刚挠结合板是在挠性印制板上再粘接两个刚性外层,刚性层上的电路与挠性层上的电路通过金属化孔相互连通。
Particularly in the manufacturing process of printed circuit board ( PCB), the dimension of appearance is not only smaller and smaller, but also the size of hole is getting smaller and smaller, and the numbers of hole is more and more on board. 特别是在印刷电路板(PCB)的制造工艺中,不但外观尺寸越来越小,而且板上孔的尺寸越来越小,孔的数目也越来越多。
On the other hand, the conventional Si semiconductor will be incapable for further higher-degree integrated circuit because its hole mobility is much lower than its electron mobility. So it is necessary to find another new semiconductor material. 另一方面,由于硅中空穴迁移率远低于电子迁移率,传统的硅半导体衬底也逐渐不能满足集成电路(IC)更高集成度的要求,寻找新型的半导体衬底也是大势所趋。
With the development of the high-density printed circuit board, the number of PCB ultra micro hole showed a trend of rapid growth. 伴随多层高密度印刷电路板的发展,需要机械加工直径小于0.2mm的印刷电路板超微细孔的数量呈迅猛增长的趋势。